Kau ʻia ma 2017-10-241 / ʻike huahana He huahana hou ʻo Diamond grit cutting fluid, ua hoʻohana nui ʻia no nā ʻano mea paʻakikī a pau (monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, gallium, indium nitride, quartz, pōhaku makamae, non-metal. mea, etc) i ka oki kaʻina hana, loaʻa maikaʻi lubrication, cooling, corrosion, rust, a me ka inhibition o hydrogen, a me TTV wafers ma hope o kaʻokiʻoki ili he uuku, uea ole trace , A me ka hiki ke hoonui i ke ola o Emery laina.2/ʻo nā hiʻohiʻona huahana1, loaʻa nā mea hoʻohui hoʻomaʻemaʻe hoʻomaʻemaʻe kūikawā, hana ʻana i nā wafer silika ma hope o ka ʻoki ʻana he maʻemaʻe loa, maʻalahi ke hoʻomaʻemaʻe ma hope o ka ʻoki ʻana; ʻO ka wafer surface a me ka warpage e hana i ka hana ʻana ma ka hoʻemi ʻana i ka nui o ka mānoanoa o Silicon; 3, liʻiliʻi ka pua, maʻalahi e hoʻohana; 4, nā mea maka a pau no ka mea mālama kaiapuni, ʻoki ʻia a maʻalahi ke mālama; pipeline mīkini hoʻopaʻa wai.
Ka manawa hoʻouna: Jan-13-2022