Hui Nui
Huina | ʻIkepili | CAS No. | EC No. |
Wai maʻemaʻe | 90-92% | 7732-18-5 | 231-791-2 |
ʻO ka sodium carbonate | 1.0-3.0% | 5968-11-6 | 207-838-8 |
Pākuʻi lālā lālā ʻalika | 1.0-2.0% | / | / |
Mea hoʻokuʻu | 1.0-1.5% | 25155-30-0 | 246-680-4 |
ʻakika mālama | 0.1%-1.5% | 137-40-6 | 205-290-4 |
Nā hiʻohiʻona
1. Kiʻekiʻe kiʻekiʻe o ka mālama ʻana i ke kaiapuni: hiki ke hoʻokō i ka etching koho me ka hoʻohana ʻole ʻana i nā kumu kūlohelohe e like me TMAH;
2. Ke kumu kūʻai haʻahaʻa haʻahaʻa: Ke hoʻohālikelike ʻia me ka pretreatment maʻamau e hoʻohana ana i ka waika hydrofluoric / nitric acid ma ka mākeke, hoʻemi nui ʻia ke kumukūʻai hana;
3. Kiʻekiʻe etching maikaʻi: Ke hoʻohālikelike ʻia me ke kaʻina hana pākaukau Perc, hoʻonui ʻia ka hoʻololi ʻana ma mua o 1.2%;
Nui wafer | Ka nana aku | Hoʻololi kiʻi uila | Ola |
210 | He mea maʻamau ka ʻili etching a ʻaʻohe corrosion o ke kiʻi maikaʻi. | 24.4%~24.6% | 240+ |
Nā ʻāpana ʻenehana
/L ʻO ka hāʻawi mua ʻana i ka wai
| /L Hoʻohāinu wai | /L Hoʻokaʻawale-wai | Ka wela/degere | Manawa pane/kekona | |
48%KOH | 8~10 | 0.3-0.45 | 5~7 | 63~64 | 100~200 |
Hoʻohui JH2570 | 2.0~4.0 | 0.18~0.21 | |||
Wai maʻemaʻe | 440.0 | / |
Hiki ke ʻokoʻa kēia mau waiwai ma muli o ka wafer kristal hoʻokahi, kaʻina hana, ka hui, a me ka nui.
Nā noi
1、Ke manaʻo nei kēia huahana i ka wehe ʻana i ka uhi silicon amorphous mai nā cell topcon;
2、 He kūpono no nā pūnaewele monocrystalline o 210, 186, 166, a me 158 kikoʻī.
Nā hiʻohiʻona huahana
ʻAʻole.
| ʻĀpana
| Nā palena nui a me nā hōʻailona papahana |
1 | kala, kino | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā |
2 | Waiwai PH | 7.0-10.0 |
3 | mānoanoa | 1.05-1.5g/ml |
4 | Nā kūlana mālama | E mālama i ka lumi wela ma kahi o ka mālamalama |