Waiwai Oki Uea Daimana JH-2523

ʻO JH-2523Diamond Wire Cutting Fluid he ʻano huahana hou, hoʻohana nui ʻia no ka ʻoki ʻana i nā ʻano mea paʻakikī paʻakikī (monocrystalline silicon, polycrystalline silicon, germanium, gallium arsenide, quartz, indium gallium nitride, gems, non-metallic. nā mea, a me nā mea'ē aʻe), nā hiʻohiʻona o ka lubrication maikaʻi loa, coo ling, corrosion resistance, rust resistance and hydrogen inhibition function.He liʻiliʻi ka ʻili silika TTV ma hope o ka ʻoki ʻana me ka hōʻailona ʻole o ka uea a hiki ke hoʻolōʻihi i ke ola o ka uea daimana.

Nā hiʻohiʻona huahana:
1. Loaʻa i nā mea hoʻohui hoʻomaʻemaʻe kemika kūikawā, i maʻemaʻe loa ka wafer silika ma hope o ka ʻoki ʻana, maʻalahi e hoʻomaʻemaʻe ma hope o ka ʻoki ʻana.
2. Loaʻa i nā mea hoʻohui hoʻomaʻemaʻe kemika kūikawā, i maʻemaʻe loa ka wafer silika ma hope o ka ʻoki ʻana, maʻalahi e hoʻomaʻemaʻe ma hope o ka ʻoki ʻana.
3. Liʻiliʻi ka huʻa, maʻalahi e hoʻohana.
4. Ka waiwai hoʻokuʻu kūʻokoʻa, e pale i ka paipu mīkini paʻakai pauka deposition block.

Ke ala noi:
Hoʻohana kēia huahana i ka ʻike mai 0.2% a i 0.5%, e like me ke kaʻina hana kūpono.
Puke, lawe a me ka waiho ʻana: 1kg / barela, 25kg / barela
Ka mālama ʻana ma ka ventilation, kahi maloʻo a maloʻo

Nā memo:
1. ʻO ka mālama ʻana i ke kaʻina o ka pale ʻana i ka aila i hui pū ʻia me ka wai, i ʻole e hōʻino paha ka huahana.
2. Inā ʻeleʻele ka waihoʻoluʻu wai i ka wā mālama a i ke kaʻina o ka hoʻohana ʻana, ʻaʻole pili i ka hopena hoʻohana.
3. Mai ʻai, holoi koke me ka wai maʻemaʻe inā komo i loko o nā maka.halemai koʻikoʻi no ka mālama ʻana.